Electronic device including heat dissipation structure
US11388841B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2019 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Jun 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/028
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.