Patent · US Active

Methods and apparatuses for packaging an ultrasound-on-a-chip

US11389137B2 · kind B2 · utility

2Cited by

9References

24Claims

0Family size

Assignee

BFLY Operations, Inc. · US

Inventors

Keith G. Fife · Palo Alto, US
Jianwei Liu · Fremont, US
Andrew Betts · Guilford, US

Key dates

Filing date	Jan 29, 2019
Grant date	Jul 19, 2022
Priority date	—
Expiry date	Dec 31, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10N30/03
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.