Method of correcting a laser radiation position
US11389876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | May 21, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A laminating and shaping apparatus includes a laser radiation unit configured to radiate a laser to a powder layer and form sintered sections, an imaging unit configured to image the sintered sections, a calculation device configured to calculate actual laser radiation positions from positions of the sintered sections and calculate a positional deviation of the laser radiation position at each of the sintered sections, and a correction device configured to correct the actual laser radiation position of each of the sintered sections to a target laser radiation position. The laser radiation unit forms sintered sections to surround the irradiation region by performing laser radiation on places including outermost positions in the irradiation region, and as the recoater head is moved in the horizontal uniaxial direction after imaging of the plurality of sintered sections by the imaging unit, at least a plurality of sintered sections are removed from the irradiation region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.