Low density microspheres

US11390056B2 · kind B2 · utility

Assignee

• Technion Research & Development Foundation Limited · IL

Inventors

• Lev Vaikhanski · Nesher, IL
• Yachin Cohen · Haifa, IL

Key dates

• Filing date: Oct 19, 2020
• Grant date: Jul 19, 2022
• Expiry date: Dec 17, 2040

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K2201/011
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.