Surface treatment to enhance bonding of composite materials
US11390060B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 20, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jan 12, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/003
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer containing blocked isocyanate compounds is applied onto a curable composite substrate, followed by co-curing. The surface treatment layer may be a resin layer without fibers or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.