Heat press devices
US11390065B2 · kind B2 · utility
3Cited by
26References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Apr 21, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB30B15/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A heat press device is provided that includes a support structure, a first platen and a heating element assembly that includes a heating element and a second platen. The heat press device further includes a movement assembly configured to change a pressure state between the first platen and the second platen when the heat press device is in a closed configuration. The heat press device can also include an indicator that is configured to convey the pressure state between the first platen and the second platen when the heat press device is in the closed configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.