Hardware packaging
US11390439B2 · kind B2 · utility
5Cited by
12References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2018 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Sep 27, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D75/367
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package backing to engage the hardware component with an interference fit. The retention feature retains the hardware component on the package backing while maintaining the front appearance surface exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.