Patent · US Active

Method for manufacturing a MEMS sensor

US11390519B2 · kind B2 · utility

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12Claims

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Assignee

Robert Bosch GmbH · DE

Inventors

Sebastian Schuler-Watkins · Herrenberg, DE
Daniel Haug · Neuffen, DE
Tobias Henn · Stuttgart, DE

Key dates

Filing date	Sep 20, 2019
Grant date	Jul 19, 2022
Priority date	—
Expiry date	Sep 20, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/037
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a MEMS sensor. The method includes: providing a substrate, applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from the front side is formed, introducing a MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.