Epoxy resin compositions containing an internal mold release agent
US11390741B2 · kind B2 · utility
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Key dates
| Filing date | Aug 3, 2017 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Aug 2, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G65/2609
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Alkoxylated hydrophobes that include a poly(alkylene oxide) chain of at least 5 oxyalkylene units having a terminal secondary hydroxyl group or a terminal C1-8 hydrocarbyl group are effective internal mold release agents for epoxy resin moldings. The alkoxylated hydrophobe, when mixed with an epoxy resin, forms a mixture that is highly stable when heated to 80 to 100° C. and held at that temperature for a period of as much as 22 days.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.