Thermal airflow sensor
US11391611B2 · kind B2 · utility
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2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal airflow sensor includes a sensor element, a bonding wire, a resin, and a protective film. The sensor element has a thin-wall portion. The thin-wall portion has a heating resistor. The bonding wire is electrically connected to the sensor element. The resin covers the bonding wire. The protective film is formed on a surface of the sensor element so that the heating resistor is exposed. The protective film has at least a slit between the resin and the thin-wall portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.