Stiffener device providing external connections to co-packaged optical devices
US11391897B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Dec 23, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4269
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.