Structural component, electronic apparatus, and fingerprint module assembly method
US11393243B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2017 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | May 27, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1329
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic apparatus includes a screen and a fingerprint circuit, where an inner surface of the screen is a light shielding layer. The light shielding layer includes a light transmission region located in a display area of the screen, and the fingerprint circuit is attached to the light transmission region using a frame adhesive. The fingerprint circuit includes a first surface facing the screen, a second surface facing away from the screen, and a side surface coupled between the first surface and the second surface. The frame adhesive includes a first connection area and a second connection area that are coupled together, where the second connection area is located on a periphery of the first connection area, the first connection area and the second connection area are bonded to the first surface, and the second connection area is fastened to the side surface using a first sealing adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.