Semiconductor device having a planar III-N semiconductor layer and fabrication method
US11393686B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jan 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/817
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a planar III-N semiconductor layer, comprising a substrate comprising a wafer (101) and a buffer layer (102), of a buffer material different from a material of the wafer, the buffer layer having a growth surface (1021); an array of nano structures (1010) epitaxially grown from the growth surface; a continuous planar layer (1020) formed by coalescence of upper parts of the nano structures at an elevated temperature T, wherein the number of lattice cells spanning a center distance between adjacent nano structures are different at the growth surface and at the coalesced planar layer; a growth layer (1030), epitaxially grown on the planar layer (1020).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.