Method of fabricating light-emitting diode display panel
US11393947B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Inventor
Key dates
| Filing date | Nov 28, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Nov 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application provides a method of fabricating a light-emitting diode (LED) display panel, including the following steps: forming an LED substrate including a first substrate, an LED chip disposed on the first substrate, and a first electrode disposed on the LED chip; forming a driving substrate including a second substrate and a second electrode disposed on the second substrate; activating surfaces of the first electrode and the second electrode; aligning and pre-bonding the first electrode with the second electrode; and bonding the first electrode and the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.