Eutectic electrode structure of flip-chip LED chip and flip-chip LED chip
US11393967B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Dec 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/032
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode includes: a light emitting structure including a first semiconductor layer, a light emitting layer arranged on at least part of the first semiconductor layer, a second semiconductor layer arranged on the light emitting layer; a first metal layer arranged on at least part of the first semiconductor layer and in contact with the first semiconductor layer; an insulating layer covered a surface of the light emitting structure; and an electrode layer arranged on the insulating layer and having at least one region that is not overlapped with the first metal layer or the second metal layer in a vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.