High-frequency connection structure for connecting a coaxial line to a planar line using adhesion layers
US11394100B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Apr 8, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Apr 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high-frequency line connection structure 1 for connecting a coaxial line and a planar line includes a conductive second adhesion layer that is formed along edges of a pair of first conductive thin films of the planar line. Furthermore, end portions of the pair of first conductive thin films and an end portion of a second conductive thin film that is adjacent to the coaxial line are disposed to coincide with a position of an inner wall of a columnar penetrating hole formed in an outer conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.