Patent · US Active

Saw device with composite substrate for ultra high frequencies

US11394365B2 · kind B2 · utility

1Cited by

0References

9Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Matthias Knapp · Munich, DE
Christian Huck · Landeck, AT

Key dates

Filing date	Apr 25, 2019
Grant date	Jul 19, 2022
Priority date	—
Expiry date	Apr 25, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/02566
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

A SAW device having a stacked design of functional layers is proposed that is build up on a carrier substrate (SUB) that is chosen to provide a high acoustic velocity. The stack further comprises a thin TCF compensation layer (TCL), a thin film piezoelectric layer (PEL) and a set of interdigital electrodes (IDE) on top of the piezoelectric layer. Energy of the desired mode mainly in the high acoustic velocity material. Despite the high possible operating frequencies the SAW device can reliably be manufactured with present lithographic techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.