Flexible circuit board, COF module and electronic device including the same
US11395403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Dec 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board includes a substrate a, a wiring pattern layer provided on the first surface of the substrate, a plating layer provided on the wiring pattern layer and including an open area, and a protective layer that contacts parts of the wiring pattern layer, the plating layer, and the substrate. The protective layer has a larger thickness than a thickness of the plating layer. The first protective layer includes a first overlapping region in which the plating layer and protective layer are in contact with each and a second overlapping region in which the plating layer and the protective layer are in contact with each other. A width of the first overlapping region may be different from a width of the second overlapping region, and each of the widths of the first and second overlapping regions is larger than a thickness of the plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.