Laser machining system for machining a workpiece by means of a laser beam and method for controlling a laser machining system
US11396062B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 13, 2020 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Jun 7, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B9/02091
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A laser machining system, or laser welding system, for machining a workpiece includes: a laser machining head for directing a laser beam onto a workpiece to produce a vapor capillary; an optical measuring device using an optical measuring beam; an image acquisition unit to capture an image of a region of the workpiece surface containing the vapor capillary and a measuring spot produced by irradiation with the measuring beam. The system determines positions of the measuring spot and vapor capillary based on the image. A method includes: directing the laser beam onto a workpiece surface to produce a vapor capillary; directing an optical measuring beam onto the surface to measure a depth of the vapor capillary; capturing an image of a region containing the vapor capillary and a measuring spot from the optical measuring beam; and determining, based on the captured image, position of the measuring spot and vapor capillary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.