Patent · US Active

Negative thermal expansion material, negative thermal expansion film and preparation method thereof

US11396454B2 · kind B2 · utility

0Cited by

0References

10Claims

0Family size

Assignees

Ordos Yuansheng Optoelectronics Co., Ltd. · CN
BOE Technology Group Co., Ltd. · CN

Inventors

Wei Li · Beijing, CN
Pan Guo · Beijing, CN
Yanqing Chen · Shantou, CN
Ning Wang · Beijing, CN
Weida Qin · Beijing, CN
Haoyi XIN · Beijing, CN
Yanfeng Li · Beijing, CN
Chao Li · Zhengzhou, CN
Yongchao Wang · Chengdu, CN

Key dates

Filing date	Jul 17, 2018
Grant date	Jul 26, 2022
Priority date	—
Expiry date	Apr 7, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/068
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A negative thermal expansion material and a preparation method thereof, and a negative thermal expansion film and a preparation method thereof are provided. The negative thermal expansion material includes Eu0.85Cu0.15MnO3-δ, wherein 0≤δ≤2.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.