Polyamic acid, polyimide film and fabrication method of the polyimide film
US11396582B2 · kind B2 · utility
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Key dates
| Filing date | Apr 21, 2020 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Apr 21, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamic acid according to an embodiment is formed by a polymerization reaction of a dianhydride compound, a first diamine compound represented by the following Formula 1, and a second diamine compound, which is different from the first diamine compound. A polyimide film derived from the polyamic acid may exhibit excellent heat resistance and improved optical properties:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.