PCB interconnect scheme for co-planar LED strips
US11396985B2 · kind B2 · utility
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Key dates
| Filing date | Aug 27, 2020 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Oct 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.