Lighting device comprising circuit board
US11397001B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 6, 2019 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Sep 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10606
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Lighting devices and methods of manufacturing lighting devices are described. A lighting devices includes at least one thermally conductive element, at least one lighting module thermally coupled to the at least one thermally conductive element, and an overmould at least partially encasing the at least one thermally conductive element, the overmould comprising at least one receiving portion. The at least one circuit board is mounted in the at least one receiving portion and is at least partially exposed from the overmould. The at least one circuit board includes at least one connector and at least two bond pads. The at least one connector includes surface accessible conduction lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.