Micromechanical pressure sensor system and method for manufacturing a micromechanical pressure sensor system

US11397121B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Uwe Schiller · Rötteln, DE
• Daniel Haug · Neuffen, DE
• Lars Sodan · Reutlingen, DE
• Michael Knauss · Pfullingen, DE
• Robert Kuells · Detmold, DE
• Sebastian Schuler-Watkins · Herrenberg, DE

Key dates

• Filing date: May 17, 2018
• Grant date: Jul 26, 2022
• Expiry date: Sep 12, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.