Color and multi-spectral image sensor based on 3D engineered material
US11397331B2 · kind B2 · utility
2Cited by
0References
16Claims
0Family size
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Key dates
| Filing date | Oct 17, 2019 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Nov 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q15/0086
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and devices to build and use multi-functional scattering structures. The disclosed methods and devices account for multiple target functions and can be implemented using fabrication methods based on two-photon polymerization or multi-layer lithography. Exemplary devices functioning as wave splitters are also described. Results confirming the performance and benefits of the disclosed teachings are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.