Method of producing electronic device
US11398389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Jul 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68354
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.