Electrostatic chuck and plasma processing apparatus including the same
US11398397B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Jan 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electrostatic chucks, plasma processing apparatuses, and methods of fabricating semiconductor devices using the same are provided. The electrostatic chuck includes a chuck base, an upper plate provided on the chuck base, and an inner plate provided between the chuck base and the upper plate. A first diameter of the inner plate is less than a second diameter of the upper plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.