Optoelectronic component and method for producing an optoelectronic component
US11398588B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2019 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Feb 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one optoelectronic semiconductor chip configured to emit radiation and an encapsulation around the semiconductor chip. The encapsulation is a polysiloxane. A barrier layer can be used for protection against harmful gases, the barrier layer being arranged on the encapsulation. The barrier layer is a plasma-polymerized siloxane layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.