Measurement of multi-layer structures
US11399713B2 · kind B2 · utility
0Cited by
3References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jan 12, 2040 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B3/113
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Systems and methods for assessing multi-layer structures in which a spectrum array is generated from low coherence interferometry and input into a statistical estimator, which determines the thickness and layer number based on the inputted spectrum and other information, including information about a source intensity noise, Poisson noise, and dark noise associated with the low coherence interferometry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.