Process for producing a plate heat exchanger and plate heat exchanger

US11400532B2 · kind B2 · utility

Assignee

• BENTELER AUTOMOBILTECHNIK GMBH · DE

Inventors

• Max Boehnke · Paderborn, DE
• Ulrich Huschen · Lichtenau, DE
• Elmar Grussmann · Altenbeken, DE
• Ulrich Rusche · Werl, DE
• Jochem Grewe · Salzkotten, DE

Key dates

• Filing date: Jul 31, 2020
• Grant date: Aug 2, 2022
• Expiry date: Jul 31, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E60/10
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.