Micromechanical sensor device with improved liquid tightness protection

US11401157B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Christian Doering · Stuttgart, DE
• Christoph Schelling · Stuttgart, DE
• Franziska Rohlfing · Leonberg, DE
• Johannes Kenntner · Magstadt, DE
• Thomas Friedrich · Bietigheim-Bissingen, DE
• Timo Lindemann · Reutlingen, DE

Key dates

• Filing date: Jun 27, 2018
• Grant date: Aug 2, 2022
• Expiry date: Jun 5, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/0264
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical sensor device and a corresponding production method, in which the micromechanical sensor device is equipped with a sensor substrate having a front side and a rear side, a sensor region provided on the front side that can be brought into contact with an environmental medium, and a capping device, attached on the front side, for capping the sensor region. In the capping device and/or in the sensor substrate, one or more capillaries are formed for conducting the environmental medium onto the sensor region, a liquid-repellent layer being provided at least in some regions on the inner walls of the capillaries.