Polyethylene resin composition
US11401406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jul 30, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/062
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a polyethylene resin composition exhibiting excellent processability and bubble stability, which can provide a film or fiber having excellent physical properties through various processes. The polyethylene resin composition includes a first polyethylene resin having a density of 0.950 g/cm3 to 0.960 g/cm3, a weight average molecular weight of 80000 g/mol to 100000 g/mol and a molecular weight distribution of 3.3 to 4.0; and a second polyethylene resin having a density of 0.950 g/cm3 to 0.960 g/cm3, a weight average molecular weight of 500000 g/mol to 600000 g/mol and a molecular weight distribution of 1.3 to 2.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.