Photosensitive resin composition, complex, laminated structure and display device, and electronic device including the same
US11401468B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Dec 14, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133617
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition includes (A) a photo-conversion material; (B) a metal-containing compound; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, wherein the metal-containing compound includes a *—S-M-S—* (M is Zn, Al, Mg, Ca, Sc, Ti, 5 V, Cr, Mn, Fe, Co, Ni, Cu, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl) structure, a complex including a polymer matrix in which a photo-conversion material is dispersed, wherein the polymer matrix includes a *—S-M-S—* (M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl) structure and an ester linking group, a laminated structure including the complex, and a display device and an electronic device including the laminated structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.