Floor panel for forming a floor covering and method for manufacturing such floor panels
US11401719B2 · kind B2 · utility
4Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 2021 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Feb 2, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/0064
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method may be provided for manufacturing a floor panel having a substrate and a top layer. The top layer may have a decorative layer that includes a digital print and a transparent or translucent wear layer. The method may involve providing the substrate with the digital print by jetting one or more inks from a set of inks using a digital inkjet printer. The ink may include a binding agent that is present in an amount below 20 percent by weight of the ink. The translucent or transparent wear layer may be laminated on top of the digital print.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.