Via for magnetic core of inductive component
US11404197B2 · kind B2 · utility
1Cited by
55References
20Claims
0Family size
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Key dates
| Filing date | Jun 8, 2018 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | May 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/348
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Techniques for fabricating low-loss magnetic vias within a magnetic core are provided. According to some embodiments, vias with small, well-defined sizes may be fabricated without reliance on precise alignment of layers. According to some embodiments, a magnetic core including a low-loss magnetic via can be wrapped around conductive coils of an inductor. The low-loss magnetic vias can improve performance of an inductive component by improving the quality factor relative to higher loss magnetic vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.