Electrical device package structure and manufacturing method thereof
US11404209B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Oct 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G11/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.