Electrostatic chuck and substrate processing apparatus including the same
US11404252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jul 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck includes a chuck plate configured to mount a substrate, an insulation pillar provided outside the chuck plate, the insulation pillar having a pin hole formed therein, a first movable ring provided on the insulation pillar, surrounding a side of the chuck plate, a second movable ring configured to cover at least a part of an upper portion of the first movable ring, and a driving pin configured to move in the pin hole of the insulation pillar in a vertical direction, the driving pin overlapped by at least a part of the first movable ring and at least a part of the second movable ring in the vertical direction. The driving pin is configured to drive the first movable ring and the second movable ring in the vertical direction or to drive the second movable ring in the vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.