Patent · US Active

Plasma-based process for production of F and HF from benign precursors and use of the same in room-temperature plasma processing

US11404280B2 · kind B2 · utility

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2References
5Claims
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Assignee

Inventors

Key dates

Filing dateOct 26, 2020
Grant dateAug 2, 2022
Priority date
Expiry dateFeb 9, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/335
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Methods and apparatuses for the production of HF in an electron-beam generated plasma. A gas containing fluorine, hydrogen, and an inert gas such as argon, e.g., Ar/SF6/H2O or Ar/SF6/NH3 flows into a plasma treatment chamber to produce a low pressure gas in the chamber. An electron beam directed into the gas forms a plasma from the gas, with energy from the electron beam dissociating the F-containing molecules, which react with H-containing gas to produce HF in the plasma. Although the concentration of the gas phase HF in the plasma is a very small fraction of the total gas in the chamber, due to its highly reactive nature, the low concentration of HF produced by the method of the present invention is enough to modify the surfaces of materials, performing the same function as aqueous HF solutions to remove oxygen from an exposed material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.