Power module with enhanced heat dissipation
US11404360B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.