Chip transfer substrate, chip transfer device and chip transfer method
US11404399B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 24, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Oct 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a chip transfer substrate, a chip transfer device and a chip transfer method. The chip transfer substrate includes a substrate, a plurality of bases spaced apart from each other on the substrate, the plurality of bases being configured to carry micro light emitting diodes (Micro LEDs) to be transferred and being movable on the substrate; and a plurality of distance adjusting components each arranged between two adjacent bases and configured to adjust a distance between the two adjacent bases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.