Micro LED based display panel
US11404400B2 · kind B2 · utility
2Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2019 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | May 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.