Component assembly and method for producing components

US11404402B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Tilman Rügheimer · Regensburg, DE
• Thomas Schwarz · Rhede, DE
• Lutz Höppel · Alteglofsheim, DE
• Andreas Plößl · Regensburg, DE
• Alexander F. Pfeuffer · Regensburg, DE

Key dates

• Filing date: Nov 6, 2018
• Grant date: Aug 2, 2022
• Expiry date: Apr 19, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/18
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is between the electrical devices of a same component. The at least two electrical devices of the same component are arranged next to one another and enclosed laterally by the insulating layer. The at least two electrical devices and the insulating layer of the same component are integral parts of a self-supporting and mechanically stable unit. The self-supporting and mechanically stable unit and the anchoring elements fix the positions of the components on the intermediate carrier. The components that are self-supporting and mechanically stable units are detachable from the intermediate carrier, and the anchoring elements release the components under mechanical load when the latter are removed.