Production of a semiconductor device

US11404611B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Ivar Tangring · Regensburg, DE
• Gregory Bellynck · Donaustauf, DE

Key dates

• Filing date: Aug 16, 2018
• Grant date: Aug 2, 2022
• Expiry date: Nov 19, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362

Abstract

In an embodiment a method for producing a semiconductor device includes providing a carrier with a semiconductor component arranged on the carrier, providing a layer arrangement on the carrier, the layer arrangement adjoining the semiconductor component and comprising a first and a second flowable layer, wherein the first layer is formed on the carrier and then the second layer is formed on the first layer, wherein the first layer comprises particles, wherein a density of the first layer is greater than a density of the second layer, and wherein a lateral wetting of the semiconductor component with the first layer occurs such that the first layer comprises a first configuration comprising a curved layer surface laterally with respect to the semiconductor component, and centrifuging the carrier such that the first layer comprises a second configuration as a result, wherein the first layer cannot return to the first configuration since the second layer is arranged on the first layer.