Method for manufacturing a micromechanical layer structure
US11405010B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2018 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jul 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/021
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing a micromechanical layer structure, including: providing a first protective layer patterned to have at least one opening which is filled with sacrificial layer material; depositing a functional-layer layer structure; producing a first opening in the functional-layer layer structure to at least one opening of the first protective layer, so that in at least one of the layers of the functional-layer layer structure; depositing a second protective layer so that the first opening is filled with material of the second protective layer; patterning the second protective layer and the filled first opening to have a second opening to the first protective layer, the second opening having the same or a lesser width than the first opening; removing sacrificial layer material at least in the opening of the first protective layer; and removing protective layer material at least in the second opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.