Patent · US Active

Multi-hop physical layer data collection protocol

US11405315B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Juniper Networks, Inc. · US

Inventors

Manish Talwar · Lunenburg, US
Ajay Kachrani · Nashua, US
Gert Grammel · Ditzingen, DE
Hao Wang · Gatineau, CA
Tanweer Biswas · Ottawa, CA

Key dates

Filing date	Sep 25, 2020
Grant date	Aug 2, 2022
Priority date	—
Expiry date	Dec 8, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH04L69/22
WIPO fieldDigital communication
WIPO sectorElectrical engineering

Abstract

Disclosed embodiments utilize a layer three and/or layer four protocol to collect physical layer properties along a multi-hop network path between a source node and a destination node. The use of a layer three or layer four protocol provides an ability to span multiple links or networks between the source node and destination node, while also collecting the physical layer properties. Once physical layer properties along a network path can be understood, decisions relating to the configuration of the network path and/or whether to communicate via the network path are improved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.