Thermal management system and method therefor
US11406010B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2020 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Jun 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.