Methods for manufacturing a plurality of electronic circuits
US11406023B2 · kind B2 · utility
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12Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 16, 2018 |
| Grant date | Aug 2, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads (contacts), and a respective flexible integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.