Patent · US Active

Film-like heat dissipation member, bendable display apparatus, and terminal device

US11406044B2 · kind B2 · utility

7Cited by

12References

17Claims

0Family size

Assignee

Huawei Technologies Co., Ltd. · CN

Inventors

Huipeng Wu · Lo Wu, CN
Quanming Li · Dongguan, CN
Guo Yang · 安丰镇, CN

Key dates

Filing date	Apr 17, 2020
Grant date	Aug 2, 2022
Priority date	—
Expiry date	Apr 17, 2040

Classification

Technology area (CPC F)Mechanical Engineering; Lighting; Heating
CPC primaryF28F2255/02
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.