Bondable microcapsules and surface functionalized fillers
US11406570B2 · kind B2 · utility
2Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2020 |
| Grant date | Aug 9, 2022 |
| Priority date | — |
| Expiry date | Aug 31, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G18/8175
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A composition comprising microcapsules functionalized with polymerizable functional groups on the surface of said microcapsules wherein the functional groups form covalent bonds with monomers in the continuous phase to enhance the mechanical properties of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.