Patent · US Active

Bonding system for dual walled turbine components

US11407057B2 · kind B2 · utility

0Cited by
7References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 8, 2020
Grant dateAug 9, 2022
Priority date
Expiry dateFeb 2, 2041

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF23R2900/00018
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A bonding system is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding system includes a plurality of bonding probes and controller circuitry. The bonding probes include a three dimensional (3D) contoured tip configured to align with a predetermined area of a 3D contoured cover sheet of a dual wall structure. The controller circuitry comprises processor circuitry and sensor circuitry. The sensor circuitry provides a location of an area of the 3D contoured cover sheet for bonding. The processor circuitry identifies a bonding probe having a contacting area that aligns with the 3D contour of the cover sheet in the location provided by the sensor circuitry.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.